Author Information

Paper Submission Guidelines

Manuscript should be written in English. Each paper must not exceed 8 pages including figures and references. Papers beyond 6 pages are subject to page surcharges @ INR 1000 per page in addition to the registration fee.

Please prepare your manuscript using Standard IEEE conference templates for LaTeX or Microsoft Word available at: Latex Template or Microsoft Word Template.

Manuscript Submission:

Upload your manuscript via easychair at: https://easychair.info/conferences/?conf=cict20170. Please contact Publication Chair Dr. P. K. Singh (pksingh@iiitm.ac.in) if you have any questions about submitting your manuscripts.

Important Notices:

Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (double submission). These matters are taken very seriously and the IEEE will take action against any author who has engaged in either practice. IEEE policies on plagiarism and double submission are available at:

IEEE Web Page on Plagiarism:

http://www.ieee.org/web/publications/rights/Plagiarism_Guidelines_Intro.html

IEEE Web Page on Double Submission:

http://www.ieee.org/web/publications/rights/Multi_Sub_Guidelines_Intro.html

To be published in the CICT 2017 Conference Proceedings and to be eligible for publication in IEEEXplore®, an author of an accepted paper is required to register for the conference at the full (member or non-member) rate and the paper must be presented by an author of that paper at the conference unless the TPC Chair grants permission for a substitute presenter arranged in advance of the event and who is qualified both to present and answer questions. Non-refundable registration fees must be paid prior to uploading the final camera-ready version of the paper. For authors with multiple accepted papers, one full registration is valid for up to 2 papers. Accepted and presented papers will be published in the CICT 2017 Conference Proceedings and likely to be submitted to IEEE Xplore®.

Call for Papers

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